AccuCircuits, Inc.
"
Your Off-Shore PCB Specialists"
Multilayer Boards
Single/Double Side
Flexible
Rigid-Flex
Silver Through Hole
Metal Based
Teflon
Back Panel
Blind Via Holes
Build Up
Heavy Ounce Copper
You are here:
Home
>
Product
> Build Up
Build Up
Specifications:
Layer :
4 ~ 24
Material :
FR4, FR5
Thickness :
0.6 ~ 3.2mm
Cu(In/Ex)
:
1/2 ~ 2Oz
Finish :
HASL, Gold Plating
Min Hole
:
0.2mm
Home
|
About Us
|
Product
|
Technology
|
Solution
|
Contact Us
© Copyright 2001: AccuCircuits, Inc.