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Production Details
Capacity
Capability
Silver Via Hole
Hidden Via Hole
Quality
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Capability
 
Prototype and pre-production quantities.
Scheduled low volume production.
Scheduled volume production.
 Max. Layers 44
 Max. Board Size 500mm x 700mm
 Max. Board Thickness 5.0mm(0.2")
 Min. Board Thickness 4Layers : 12mil(0.3mm)
6Layers : 16mil(0.4mm)
 Controlled Impedance ± 5%
 Min. Hole Diameter 0.1mm Finished
 Aspect Ratio 8 : 1
 Max. Finished Copper 4Oz
 Min. Lines/Spaces 4mil(1mm)
 Min. SMD Pitch 7.8mil
 Solder Mask Wet Epoxy Ink
LPI(Liquid Photo Imageable)
Surface Finish HASL(Hot Air Solder Leveling)
OSP(Organic Surface Protection)
ENIG(Ni/Au : 100u”/3u”)
Electrolytic Gold
Immersion Tin
Carbon Printing
Immersion Silve

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