 |
AccuCircuits, Inc.
"Your Off-Shore PCB Specialists" |
|
 |
|
|
|
|
| You are here: Home > Technology >Hidden Via Hole |
| |
| Hidden Via Hole |
| |
Introduction:
Hidden Laser Via Technology was conceived not only to improve manufacturability of Printed Circuit Boards, but also to contribute to the manufacturability and reliability in other facets of the electronics industry using area array parts (BGA, CSPs, BGAs, and DCAs). Thanks to the evolution of handheld devices (cell phones, pagers, PDAs, etc.) designs are employing faster and smaller chip packages, while looking for ways of placing more circuitry on available real estate
Motive:
Compared to the vast improvements of other electronic components, the Printed Circuit Board industry still has a long way to go. Currently, solder ball formation is a major hurdle for assembly of IC and BGA components onto the PCB. However, the Hidden Laser Via Technology will solve this problem and will solve the disconnection problem as well. |
|
|
|
