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Silver Via Hole
Hidden Via Hole
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Production Details
 
Drilling:
  Process standard hole diameters of 4:1 aspect ratio.
  Smaller hole diameters of more than 4:1 aspect ratio.
  Blind and buried via capability.
     
Surface Finishes:
  Tin/Lead plate with Hot Oil Reflow.
  Omikron( White Tin)
  Solder Mask Over Bare Copper (SMOBC), with Hot Air Solder Level (HASL).
  Selective and "Deep Well" Nickel/Gold Plating.
  Nickel/Gold connector tabs. (Type 1 & 2, Grade C gold).
  Selective Solder Strip.
     
Circuit Traces & Spacing:
  Fine Line technology to .004".
  Fine Pitch Surface Mount Technology (SMT).
 
Solder Mask & Legend:
  Liquid Photoimageable Soldermask.
  Dry Film Soldermask.
  Standard screen epoxy masks.
  Silkscreen Nomenclature standard epoxy.
     
Electrical Testing:
  Trace 948 100 Volt Universal Grid Test System.
  Test area of 16.0" X 22.0" in. with 35,000 test points.
  Clamshell testing with SMT.
  Net list testing from Gerber Data.
  High voltage testing.

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