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Silver Via Hole
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Silver Via Hole
 
High density PCBs are made with electrical connections between both sides of the board. This is achieved, not by copper plating but rather screen printing of highly conductive and reliable silver paste into the drilled holes.

FEATURES
High density patterns with through hole pitch of 1.5mm
Excellent insulation properties between silver through holes
Lower in cost compared to copper plated through holes
High reliability of products with paper phenol and CEM grade materials

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