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AccuCircuits, Inc.
"Your Off-Shore PCB Specialists" |
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| You are here: Home > Technology > Technical Roadmap |
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| Technical Roadmap |
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| (Unit : mm) |
| Min. Line/Spacing, Internal Layer |
0.125 |
0.1 |
0.1 |
0.075 |
| Min. Line/Spacing, Internal Layer |
0.125 |
0.11 |
0.1 |
0.075 |
| Min. Drilled Hole Size |
0.2 |
0.15 |
0.1 |
0.075 |
| Aspect Ratio(Thickness to Min. Hole Diameter) |
10 |
12.8 |
15 |
20 |
| Land Size Internal(Diameter Over Drill) |
Hole+0.3 |
Hole+0.25 |
Hole+0.25 |
Hole+0.2 |
| Land Size External(Diameter Over Drill) |
Hole+0.3 |
Hole+0.25 |
Hole+0.25 |
Hole+0.2 |
| No-Connect(Diameter Over Drill) |
0.65 |
0.6 |
0.5 |
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| Plated Through Hole Tolerance |
±0.075 |
±0.05 |
±0.05 |
±0.05 |
| Min. Laser Via Hole |
0.127 |
0.1 |
0.075 |
0.05 |
| Laser Via Land Size(Diameter over Drill) |
0.25 |
0.2 |
0.17 |
0.150.05 |
| Min. Dielectric Thickness |
0.09 |
0.06 |
0.06 |
0.05 |
| Min. Core Thickness |
0.1 |
0.08T |
0.08T |
0.06T |
| Max. PCB Thickness |
4 |
4.5 |
4.5 |
5 |
| Thickness Tolerance(%) |
10% |
8% |
8% |
5% |
| Max. Board Dimensions |
580X480 |
580X580 |
600X600 |
580X700 |
| Bow and Twist(Through Hole - %) |
1% |
0.80% |
0.80% |
0.6% |
| Bow and Twist(SMT - %) |
1% |
0.75% |
0.75% |
0.6% |
| Min Conductor to Edge(When rout) |
0.3 |
0.25 |
0.2 |
0.15 |
| Min Conductor to Edge(When V-Cut) |
0.75 |
0.6 |
0.6 |
0.5 |
| Layer To Layer Registration Tolerance |
0.1 |
0.076 |
0.076 |
00.5 |
| Soldermask Clearance |
0.07 |
0.05 |
0.05 |
0.03 |
| Soldermask Dams |
0.075 |
0.05 |
0.05 |
0.04 |
| Impedance Tolerance(~ ohms +/- %) |
10% |
7% |
7% |
5% |
| Max. Layers |
28 |
32 |
40 |
48 |
| Max. Copper Weight Internal(Oz.) |
3OZ |
4OZ |
4OZ |
5OZ |
| Max. Copper Weight External(Oz.) |
3OZ |
4OZ |
4OZ |
5OZ |
| 100 Mil Grid |
YES |
YES |
YES |
YES |
| 70 Mil Grid |
YES |
YES |
YES |
YES |
| Flying Probe |
YES |
YES |
YES |
YES |
| CEM-1 and CEM-3 |
YES |
YES |
YES |
YES |
| FR-1 and FR-2 and FR-4 |
YES |
YES |
YES |
YES |
| FR-4 High Tg |
YES |
YES |
YES |
YES |
| Polyimide |
YES |
YES |
YES |
YES |
| Teflon |
YES |
YES |
YES |
YES |
| Rogers |
YES |
YES |
YES |
YES |
| FR-4 + Rogers |
YES |
YES |
YES |
YES |
| Metal Core |
YES |
YES |
YES |
YES |
| Through Via |
YES |
YES |
YES |
YES |
| Blind and Buried Via |
YES |
YES |
YES |
YES |
| Laser Via |
YES |
YES |
YES |
YES |
| HASL(Hot Air Solder Levelling) |
YES |
YES |
YES |
YES |
| OSP(Organic Surface Protection) |
YES |
YES |
YES |
YES |
| Immersion Tin Plating |
YES |
YES |
YES |
YES |
| Immersion Gold Plating |
YES |
YES |
YES |
YES |
| Immersion Silver Plating |
YES |
YES |
YES |
YES |
| Electrolytic Gold Plating |
YES |
YES |
YES |
YES |
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