|
C a p a b i l i t
i e s
AccuCircuit,
Accu Circuit, Printed Circuit Boards, Off-Shore Printed Circuit
Boards, Off-Shore Manufacturing, Printed Circuit Board Fabricators,
Printed Circuit Board Representatives, Assembly, Rigid-Flex/ Flex/
Flexible, Global manufacturing, Electronic Manufacturing, OEM,
Prototype, Printed Wire, Boards, Semi-conductor, High-Volume Production,
Surface Mount, Turn-key, Quick turnaround, Double sided, Multi-layer,
Cable harness, Drill and Router accessories, UV Metal halide lamps,
Metal-core Gerber, Cad/cam, SMT Solder Paste Stencils, Electronic
equipment
AccuCircuit,
Accu Circuit, Printed Circuit Boards, Off-Shore Printed Circuit
Boards, Off-Shore Manufacturing, Printed Circuit Board Fabricators,
Printed Circuit Board Representatives, Assembly, Rigid-Flex/ Flex/
Flexible, Global manufacturing, Electronic Manufacturing, OEM,
Prototype, Printed Wire, Boards, Semi-conductor, High-Volume Production,
Surface Mount, Turn-key, Quick turnaround, Double sided, Multi-layer,
Cable harness, Drill and Router accessories, UV Metal halide lamps,
Metal-core Gerber, Cad/cam, SMT Solder Paste Stencils, Electronic
equipment
Capabilities
Chart :
|
Max layer
|
: 42
layer |
|
Max Board Size
|
: 22in.
X 29.5in. (560mm X 750mm) |
|
Max Board Thickness
|
: 0.2in.
(5.0 mm) |
|
Min Board Thickness
|
: 0.012in.
(0.3 mm) for 4 layer |
| |
: 0.016in.
(0.4 mm) for 6 layer |
|
Conduction Width
|
: 0.004in.
(0.1 mm) |
|
Conduction Space
|
: 0.003in.
(0.076 mm) |
|
MIn Hole Diameter
|
: 0.0078in.
(0.2 mm) 7.8 mil finished |
|
Min SMD Pitch
|
: 1/128in.
(0.2mm) 7.8 mil |
|
Solder Mask :
|
: Wet
Epoxy Ink |
| |
: Liquid
Photo Imageable Ink |
|
Surface Coating
|
: Pre
Flux |
| : Hot
Air Solder Levelling |
| : Electrolytic
Gold Plating |
| : Electroless
Gold Plating |
| : Solder
Plating |
|
